May 20, 2003 (Elmsford, NY) - Reveo Laboratories has been awarded a contract from DARPA entitled, "MFT Multi-Fillo Layer Technology." This is to be the first phase of a multi-phased program to develop Reveo’s invention of a set of processes and techniques that allow for very dense packing of silicon-based devices and structures. These processes and techniques are collectively called Multi Filo-layer Technology or MFT.
The MFT process permits the packaging of active silicon structures up to 3 orders of magnitude denser than existing packaging schemes while not requiring any exotic or unknown processes or materials. This allows the significant increase in silicon densities without the need to spend billions decreasing line widths. This enables the creation of new products that are impossible using today’s semiconductor device construction methods.
The project is proposed to develop the materials, processes and equipment required to implement the MFT process for silicon wafer-based products. The goal of the project is to develop the MFT processes such that they can be easily integrated into existing semiconductor process operations and become a standard option for structuring silicon to create new products. This proposal covers all activities needed to develop the various aspects of the MFT process from proof-of-concept to production commercialization.
Dr. Sadeg M. Faris, the inventor, and Chairman of Reveo commented, "This is such a significant contract, supporting a radical enabling technology that will impact many industries like IC’s MEMS, nanotechnology, optoelectronics and energy. This especially will have a revolutionary impact on electronics in 21 st century." He added, "This contract will position us to be a leader in the field to InventQbate tm several companies based on MFT IP."