ELMSFORD, NY (April 20, 2004) - Reveo presented its controversial and revolutionary Multi-Filo Layer Technology (MFT) at the 3D Architecture conference, hosted by RTI International in San Francisco, CA. This conference brought together the leading research and development companies and institutions involved in 3D packaging for integrated circuits, including well known companies such as IBM, Motorola, Sun Microsystems, and Toshiba. Numerous cutting-edge technologies were presented by representatives of the various companies, but none garnered as much attention as Dr. Faris', CEO of Reveo, presentation on its MFT technology.
The proprietary MFT process permits the packaging of active silicon structures more than 3 orders of magnitude denser than existing packaging schemes while not requiring any exotic or unknown processes or materials. This allows a significant increase in silicon densities without the need to spend billions decreasing line widths, enabling the creation of new products that are impossible using today’s semiconductor device construction methods. While most of the attendees of the conference were well aware of these facts and the favorable economics of 3D ICs, their approaches were often limited to conventional methods and practices of the IC industry and thus only able to stack, at most, a few chips at a time.
The differentiating feature of the MFT process is its ability to scale to thousands of layers, which is truly extreme 3D integration as compared to the limited 3D approaches favored by IBM and the others. This integration is all done at the wafer level, with close to 100% yield. Thanks to the support of DARPA, Reveo has been continuosly developing its MFT technology, making several critical breakthroughs in the fundamental science. The goal of the MFT project is to develop the MFT processes such that they can be easily integrated into existing semiconductor process operations and become a standard option for structuring silicon to create entirely new products.
Dr. Sadeg M. Faris, the inventor of the technology, commented after the show, "This is such a significant, radical technology, and such an enabling one that will impact so many industries like IC’s, MEMS, nanotechnology, optoelectronics and energy. I'm so surprised and excited that all the other leading companies in this field are so far behind as compared to where we are and what we are trying to accomplish."